Diffusion barrier properties of ionized metal plasma deposited tantalum nitride thin films between copper and silicon dioxide

✍ Scribed by Khin Maung Latt; Y. K. Lee; H. L. Seng; T. Osipowicz

• Book ID: 110318809
• Publisher: Springer
• Year: 2001
• Tongue: English
• Weight: 412 KB
• Volume: 36
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1023/a:1013088624226