Study of diffusion barrier properties of ionized metal plasma (IMP) deposited TaN between Cu and SiO2

✍ Scribed by Y.K Lee; Khin Maung Latt; Kim Jaehyung; Kangsoo Lee

• Publisher: Elsevier Science
• Year: 2000
• Tongue: English
• Weight: 468 KB
• Volume: 3
• Category: Article
• ISSN: 1369-8001
• DOI: 10.1016/s1369-8001(00)00002-0