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Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles

โœ Scribed by Yaowu Shi; Jianping Liu; Yanfu Yan; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li


Publisher
Springer US
Year
2007
Tongue
English
Weight
457 KB
Volume
37
Category
Article
ISSN
0361-5235

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