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Creep property of composite solders reinforced by nano-sized particles

โœ Scribed by Yaowu Shi; Jianping Liu; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li

Publisher
Springer US
Year
2007
Tongue
English
Weight
291 KB
Volume
19
Category
Article
ISSN
0957-4522

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