✦ LIBER ✦
Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints
✍ Scribed by Yaowu Shi; Jianping Liu; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 314 KB
- Volume
- 21
- Category
- Article
- ISSN
- 0957-4522
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