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Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions

โœ Scribed by F. Tai; F. Guo; Z. D. Xia; Y. P. Lei; Y. F. Yan; J. P. Liu; Y. W. Shi

Publisher
Springer US
Year
2005
Tongue
English
Weight
422 KB
Volume
34
Category
Article
ISSN
0361-5235

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Processing treatment of a lead-free Snโ€“Agโ€“Cuโ€“Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection
โœ X.P. Zhang; C.B. Yu; Y.P. Zhang; S. Shrestha; L. Dorn ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 231 KB

In this study, the processing performance of a lead-free Sn-Ag-Cu-Bi solder after rapid laser-beam reflowing was investigated, and the creep behaviors of the soldered joints were evaluated under different homologue temperatures from 0.68 to 0.82, with a systematical comparison to that of a Sn60Pb40