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Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

✍ Scribed by F. X. Che; W. H. Zhu; Edith S. W. Poh; X. R. Zhang; Xiaowu Zhang; T. C. Chai; S. Gao

No coin nor oath required. For personal study only.

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