✦ LIBER ✦

Development of creep-resistant, nanosized Ag particle-reinforced Sn-Pb composite solders

✍ Scribed by J. P. Liu; F. Guo; Y. F. Yan; W. B. Wang; Y. W. Shi

No coin nor oath required. For personal study only.

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Processing and creep properties of Sn-Cu

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