Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3Particles

✍ Scribed by M. Kangooie; R. Mahmudi; A.R. Geranmayeh

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 521 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-0971-4