✦ LIBER ✦
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
✍ Scribed by Yaowu Shi; Yanfu Yan; Jianping Liu; Zhidong Xia; Yongping Lei; Fu Guo; Xiaoyan Li
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 472 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.