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Correction to "Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated Circuits"

✍ Scribed by Hall, P.


Book ID
117911400
Publisher
IEEE
Year
1982
Tongue
English
Weight
42 KB
Volume
5
Category
Article
ISSN
0148-6411

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πŸ“œ SIMILAR VOLUMES


The effect of high dissipation component
πŸ“‚ Article πŸ“… 1985 πŸ› Elsevier Science 🌐 English βš– 94 KB

An analytical method is described which provides estimates to first ordel of the number of either power or environmental cycle's leading to solder joint failure. Various parameter variations such as solder joint height, ceramic chip carrier (CCC) size, printed circuit substrate (PCS) material, etc.