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Ultrasonic bonding of integrated circuits to thick-film pedestals on ceramic substrates : T. J. Matcovich, R. L. Coren, D. G. Kelemen and R. J. Galli, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 254


Publisher
Elsevier Science
Year
1970
Tongue
English
Weight
100 KB
Volume
9
Category
Article
ISSN
0026-2714

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