✦ LIBER ✦
A new package-related failure mechanism for leadless ceramic chip carriers (LC-3s) solder-attached to Alumina substrates : Robert T. Howard, Steven W. Sobeck and Christopher Sanetra. Solid St. Technol., 115 (February 1983)
- Book ID
- 103277012
- Publisher
- Elsevier Science
- Year
- 1983
- Tongue
- English
- Weight
- 226 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.