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Solder post attachment of ceramic chip carriers to ceramic film integrated circuits: Peter M. Hall IEEE Trans. Components Hybrids Mfg Technol. CHMT-4 (4), 403 (1981)

Book ID: 108361246
Publisher: Elsevier Science
Year: 1983
Tongue: English
Weight: 104 KB
Volume: 14
Category: Article
ISSN: 0026-2692
DOI: 10.1016/s0026-2692(83)80143-8

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