The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates : Jim T. Lynch, M. R. Ford and Alberto Boetti. IEEE Trans. Components Hybrids Mfg Technol.Chmt-6 (3), 237 (September 1983)

• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 132 KB
• Volume: 24
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(84)90239-7