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The measurement of flux residues from chip carrier attachment and their effect on other thick film hybrid components : Jim T. Lynch, Robert T. Bilson, Nigel R. Matthews and Alberto Boetti. IEEE Trans. Components Hybrids Mfg Technol. CHMT-7, 336 (1984)

Publisher: Elsevier Science
Year: 1985
Tongue: English
Weight: 136 KB
Volume: 25
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(85)90627-4

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The effect of high dissipation component

The effect of high dissipation components on the solder joints of ceramic chip carriers attached to thick film alumina substrates : Jim T. Lynch, M. R. Ford and Alberto Boetti. IEEE Trans. Components Hybrids Mfg Technol.Chmt-6 (3), 237 (September 1983)

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The effect of high dissipation component

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An analytical method is described which provides estimates to first ordel of the number of either power or environmental cycle's leading to solder joint failure. Various parameter variations such as solder joint height, ceramic chip carrier (CCC) size, printed circuit substrate (PCS) material, etc.