✦ LIBER ✦
Tailored coefficient of thermal expansion printed wiring boards to improve the solder joint life of leadless ceramic chip carriers : R. L. Williams and A. W. Noblett. Circuit World 15(2), 30 (1989)
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 131 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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