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Compensating corner undercutting in anisotropic etching of (100) silicon

✍ Scribed by Xian-Ping Wu; Wen H. Ko

Publisher: Elsevier Science
Year: 1989
Weight: 865 KB
Volume: 18
Category: Article
ISSN: 0250-6874
DOI: 10.1016/0250-6874(89)87019-2

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