✦ LIBER ✦

Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

✍ Scribed by Dezhi Li; Changqing Liu; Paul P. Conway

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Characteristics of Sn-2.5Ag flip chip so

✍ Kyoung Chun Yang; Seong Hyuk Lee; Jong-Min Kim; Young Ki Choi; Dave F. Farson; Y 📂 Article 📅 2009 🏛 Springer-Verlag 🌐 English ⚖ 654 KB

Effect of silver content on the shear fa

✍ Yoshiharu Kariya; Takuya Hosoi; Shinichi Terashima; Masamoto Tanaka; Masahisa Ot 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 579 KB

Influence of initial morphology and thic

✍ X. Deng; G. Piotrowski; J. J. Williams; N. Chawla 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 247 KB

The morphology and kinetic evolution of

✍ S. Y. Chang; L. C. Tsao; M. W. Wu; C. W. Chen 📂 Article 📅 2011 🏛 Springer US 🌐 English ⚖ 960 KB

Effects of Minor Additions of Zn on Inte

✍ Moon Gi Cho; Sung K. Kang; Da-Yuan Shih; Hyuck Mo Lee 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 706 KB

Influence of Cu content on compound form

✍ Guh-Yaw Jang; Jeng-Gong Duh; Hideyuki Takahashi; Szu-Wei Lu; Jen-Chuan Chen 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 492 KB