Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions

✍ Scribed by Kyoung Chun Yang; Seong Hyuk Lee; Jong-Min Kim; Young Ki Choi; Dave F. Farson; Young Eui Shin

• Book ID: 107624541
• Publisher: Springer-Verlag
• Year: 2009
• Tongue: English
• Weight: 654 KB
• Volume: 23
• Category: Article
• ISSN: 1738-494X
• DOI: 10.1007/s12206-008-1124-z