## Abstract AlGaN/GaN heterostructure devices are capable of delivering high‐frequency power amplifiers and power switches with performances far superior than those offered by the mainstream silicon technology and other advanced semiconductor technologies. Primarily driven by applications' need, th
AlGaN/GaN HEMT Optimization Using the RoundHEMT Technology
✍ Scribed by Marso, M. ;Javorka, P. ;Alam, A. ;Wolter, M. ;Hardtdegen, H. ;Fox, A. ;Heuken, M. ;Kordos, P. ;L�th, H.
- Book ID
- 101384049
- Publisher
- John Wiley and Sons
- Year
- 2001
- Tongue
- English
- Weight
- 82 KB
- Volume
- 188
- Category
- Article
- ISSN
- 0031-8965
No coin nor oath required. For personal study only.
✦ Synopsis
The electrical characterization of epitaxially grown HEMT layer systems for device fabrication is commonly performed by Hall measurements. However, the ultimate characterization of a HEMT layer system is the transistor device itself. The RoundHEMT concept meets the need for a device technology with few fabrication steps that allows a fast feedback to epitaxy while providing an evaluation of important electrical and also processing data. Even though nearly identical Hall data on structures with different thickness and doping concentration of the AlGaN layers suggest similar device properties, the RoundHEMTs resolve remarkable differences in device performance. The best layer structure was used to fabricate HEMTs with I DS = 700 mA/mm, f T = 35 GHz, and f max = 70 GHz for L G = 0.2 mm.
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