✦ LIBER ✦

A testing method for assessing solder joint reliability of FCBGA packages

✍ Scribed by Jinlin Wang; H.K. Lim; H.S. Lew; Woon Theng Saw; Chew Hong Tan

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Evaluation of solder joint reliability i

✍ Jong-Woong Kim; Dae-Gon Kim; Won Sik Hong; Seung-Boo Jung 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 901 KB

Evaluation of solder joint reliability i

✍ Dae-Gon Kim; Jong-Woong Kim; Seung-Boo Jung 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 696 KB

Using finite element analysis for simula

✍ Cemal Basaran; Rumpa Chandaroy 📂 Article 📅 2000 🏛 Elsevier Science 🌐 English ⚖ 293 KB

Design of Solder Joint Structure for Fli

✍ Jong-Woong Kim; Seung-Boo Jung 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 453 KB

A novel accelerated test technique for a

✍ G. Khatibi; W. Wroczewski; B. Weiss; H. Ipser 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 740 KB

Numerical and experimental analysis of l

✍ Li Zhang; Vivek Arora; Luu Nguyen; Nikhil Kelkar 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 617 KB