✦ LIBER ✦
Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages
✍ Scribed by Li Zhang; Vivek Arora; Luu Nguyen; Nikhil Kelkar
- Book ID
- 108210460
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 617 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0026-2714
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