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Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging

✍ Scribed by Cemal Basaran; Rumpa Chandaroy

Publisher: Elsevier Science
Year: 2000
Tongue: English
Weight: 293 KB
Volume: 74
Category: Article
ISSN: 0045-7949
DOI: 10.1016/s0045-7949(99)00028-0

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