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Wafer-Lever Hermetic Package with Through-Wafer Interconnects

✍ Scribed by Wang Yu-Chuan; Zhu Da-Peng; Xu Wei; Le Luo

Book ID
107453534
Publisher
Springer US
Year
2007
Tongue
English
Weight
331 KB
Volume
36
Category
Article
ISSN
0361-5235

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This paper presents a technology for a fully tileable two-dimensional (2D) photodiode matrix for medical imaging, specifically X-ray computed tomography (CT). A key trend in the CT industry is to build machines with larger area detector to speed up the measurements and to avoid image blurring due to