Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages

✍ Scribed by Changsoo Jang; Byeng Dong Youn; Ping F. Wang; Bongtae Han; Suk-Jin Ham

• Book ID: 108210848
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 904 KB
• Volume: 50
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2009.11.014