Package-and wafer-level electromigration tests on Al−Cu interconnect with Ti and TiN underlayers

✍ Scribed by Young Bae Park; Dok Won Lee

• Book ID: 105696435
• Publisher: TechnoPress
• Year: 2001
• Tongue: English
• Weight: 830 KB
• Volume: 7
• Category: Article
• ISSN: 1598-9623
• DOI: 10.1007/bf03027092