✦ LIBER ✦
Impact of 5% NaCl Salt Spray Pretreatment on the Long-Term Reliability of Wafer-Level Packages with Sn-Pb and Sn-Ag-Cu Solder Interconnects
✍ Scribed by Bo Liu; Tae-Kyu Lee; Kuo-Chuan Liu
- Book ID
- 107457352
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 769 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0361-5235
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