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Wafer direct bonding with ambient pressure plasma activation

✍ Scribed by Markus Gabriel; Brad Johnson; Ralf Suss; Manfred Reiche; Marko Eichler

Book ID: 106184833
Publisher: Springer-Verlag
Year: 2006
Tongue: English
Weight: 309 KB
Volume: 12
Category: Article
ISSN: 0946-7076
DOI: 10.1007/s00542-005-0044-4

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