Surface activation using remote plasma for silicon to quartz wafer bonding
β Scribed by R. E. Belford; S. Sood
- Book ID
- 106185596
- Publisher
- Springer-Verlag
- Year
- 2008
- Tongue
- English
- Weight
- 323 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0946-7076
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A novel, easily applicable surface passivation technique is presented, which, in combination with contactless photocoductance decay (PCD) measurements, allows a quick estimation of the bulk carrier lifetime of crystalline silicon wafers. The proposed passivation technique requires neither a chemical
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