Modification of Si(100)-Surfaces by SF6 Plasma Etching — Application to Wafer Direct Bonding

✍ Scribed by M. Reiche; U. Gösele; M. Wiegand

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 423 KB
• Volume: 35
• Category: Article
• ISSN: 0232-1300
• DOI: 10.1002/1521-4079(200007)35:6/7<807::aid-crat807>3.0.co;2-j