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Ultra-large scale integration

โœ Scribed by Meindl, J.D.


Book ID
114594900
Publisher
IEEE
Year
1984
Tongue
English
Weight
856 KB
Volume
31
Category
Article
ISSN
0018-9383

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Copper electroless deposition technology
โœ Yosi Shacham-Diamand; Valery M. Dubin ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 711 KB

In this paper we present the technology of electroless Cu deposition for ultra-large-scale integration. The technology has several components: the solution chemistry, the operation conditions, the seeding, the equipment and the process integration. Sodium-free solution was used and optimized to achi