๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

New trends in plasma etching for ultra large scale integration technology

โœ Scribed by O. Joubert


Book ID
114155732
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
600 KB
Volume
41-42
Category
Article
ISSN
0167-9317

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Copper electroless deposition technology
โœ Yosi Shacham-Diamand; Valery M. Dubin ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 711 KB

In this paper we present the technology of electroless Cu deposition for ultra-large-scale integration. The technology has several components: the solution chemistry, the operation conditions, the seeding, the equipment and the process integration. Sodium-free solution was used and optimized to achi