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Transport processes and large deformation during baking of bread

✍ Scribed by J. Zhang; A. K. Datta; S. Mukherjee

Publisher
American Institute of Chemical Engineers
Year
2005
Tongue
English
Weight
297 KB
Volume
51
Category
Article
ISSN
0001-1541

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## Abstract The present study produced an integrated thermocouple in order to gain an understanding of the heat transfer mechanism during baking. The thin film thermocouple was made by depositing copper‐nickel on a polyimide sheet base, and five hot junctions were arranged at regular intervals. The