Amorphous boron and boron phosphide 5lms were prepared on silica glass by a solid source molecular beam deposition (SSMBD) method and a low-pressure chemical vapor deposition method (LPCVD) by adapting gas source molecular beam deposition at a reactant pressure of 1.33 Pa. The 5lms were characterize
Thermoelectric Properties of Boron and Boron Phosphide CVD Wafers
β Scribed by Y. Kumashiro; T. Yokoyama; A. Sato; Y. Ando
- Publisher
- Elsevier Science
- Year
- 1997
- Tongue
- English
- Weight
- 710 KB
- Volume
- 133
- Category
- Article
- ISSN
- 0022-4596
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β¦ Synopsis
Electrical and thermal conductivities and thermoelectric power of p-type boron and n-type boron phosphide wafers with amorphous and polycrystalline structures were measured up to high temperatures. The electrical conductivity of amorphous boron wafers is compatible to that of polycrystals at high temperatures and obeys Mott's T !1/4 rule. The thermoelectric power of polycrystalline boron decreases with increasing temperature, while that of amorphous boron is almost constant in a wide temperature range. The weak temperature dependence of the thermal conductivity of BP polycrystalline wafers reflects phonon scattering by grain boundaries. Thermal conductivity of an amorphous boron wafer is almost constant in a wide temperature range, showing a characteristic of a glass. The figure of merit of polycrystalline BP wafers is 10 !7 /K at high temperatures while that of amorphous boron is 10\ 5 /K.
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Boron thin 5lms were deposited by electron beam evaporation and by pyrolysis of decaborane on quartz substrates. Re6ection electron beam di4raction was used to characterize the crystal structure. The amorphous structure was observed for the 5lm deposited by electron beam evaporation. The 5lm was pol
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