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Thermally Induced Failure of Copper-Bonded Alumina Substrates for Electronic Packaging

✍ Scribed by Yuichi Yoshino; Hidehiko Ohtsu; Takashi Shibata

Book ID: 110825728
Publisher: John Wiley and Sons
Year: 1992
Tongue: English
Weight: 594 KB
Volume: 75
Category: Article
ISSN: 0002-7820
DOI: 10.1111/j.1151-2916.1992.tb04433.x

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