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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Study of metal additives to alumina substrate for high temperature and pressure application

✍ Scribed by Riko, I. M.; Pramana, S. S.; Rong, E. P. J.; Wong Chee Cheong, ; Chen Zhong, ; Yoong, A. T. I.; Lip, G. C.

Book ID: 126594634
Publisher: IEEE
Year: 2012
Weight: 635 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507049

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