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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Room temperature debonding — An enabling technology for TSV and 3D integration

✍ Scribed by Matthias, T.; Huysmans, F.; Burggraf, J.; Burgstaller, D.; Lindner, P.

Book ID: 126670646
Publisher: IEEE
Year: 2012
Weight: 540 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507084

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