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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Modeling, analysis and simulation of CNT based TSVs for RF applications

✍ Scribed by Kannan, S.; Kim, B.; Gupta, A.; Seok-Ho Noh,

Book ID: 120581816
Publisher: IEEE
Year: 2012
Weight: 340 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507158

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