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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Study of thin film metallization adhesion in ceramic multichip module

✍ Scribed by Lim Ju Dy, ; Rong, E. P. J.; Riko, I. M.; Sharif, A.; Lim Jun Zhang, ; Lau Fu Long, ; Gan Chee Lip, ; Chen Zhong, ; MinWoo, D. R.; Wong Chee Cheong,

Book ID: 126594635
Publisher: IEEE
Year: 2012
Weight: 611 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507053

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