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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of new TSV structure composing of intermetallic compounds

✍ Scribed by Daquan Yu, ; Xiaoyang Liu, ; Ran He, ; Xiangmeng Jing, ; Chongshen Song, ; Fengwei Dai, ; Yu Sun, ; Lixi Wan,

Book ID: 125539031
Publisher: IEEE
Year: 2012
Weight: 775 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507108

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