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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

✍ Scribed by Gonzalez, M.; Vandevelde, B.; Ivankovic, A.; Cherman, V.; Debecker, B.; Lofrano, M.; De Wolf, I.; Beyer, G.; Swinnen, B.; Tokei, Z.; Beyne, E.

Book ID: 121675215
Publisher: IEEE
Year: 2012
Weight: 944 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507142

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