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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fundamental study of fracture strength of silicon dies in flip-chip lidless packages

✍ Scribed by Sathanantham, R. S.; Fang Jie Foo, ; Zi Ying Oh,

Book ID: 120826171
Publisher: IEEE
Year: 2012
Weight: 912 KB
Category: Article
ISBN: 1467345512
DOI: 10.1109/EPTC.2012.6507080

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