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[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Recent developments of direct bonded copper (DBC) substrates for power modules

✍ Scribed by Schulz-Harder, J.; Exel, K.

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