[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - New Au-Al interconnect technology and its reliability by surface activated bonding

✍ Scribed by Zhonghua Xu, ; Suga, T.; Itoh, T.; Hosoda, N.

• Book ID: 118056756
• Publisher: IEEE
• Year: 2003
• Tongue: English
• Weight: 325 KB
• Volume: 0
• Category: Article
• ISBN-13: 9780780381681
• DOI: 10.1109/eptc.2003.1298785