Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging

✍ Scribed by Yin, Shan; Tseng, King Jet; Zhao, Jiyun

• Book ID: 118273773
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 826 KB
• Volume: 52
• Category: Article
• ISSN: 1359-4311
• DOI: 10.1016/j.applthermaleng.2012.11.014