✦ LIBER ✦

Thermal stability of W, WSix, and Ti/Al ohmic contacts to InGaN, InN, and InAlN

✍ Scribed by C. B. Vartuli

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Study of contact resistivity, mechanical

✍ B. P. Luther; S. E. Mohney; J. M. Delucca; R. F. Karlicek 📂 Article 📅 1998 🏛 Springer US 🌐 English ⚖ 355 KB

Low resistance Al/Ti/n-GaN ohmic contact

✍ Kwak, Joon Seop; Mohney, S E; Lin, Je-Yi; Kern, R S 📂 Article 📅 2000 🏛 Institute of Physics 🌐 English ⚖ 224 KB

Electrical characterization, metallurgic

✍ Chor, E. F.; Zhang, D.; Gong, H.; Chong, W. K.; Ong, S. Y. 📂 Article 📅 2000 🏛 American Institute of Physics 🌐 English ⚖ 455 KB

Realization of improved metallization-Ti

✍ A. Motayed; A.V. Davydov; W. J. Boettinger; D. Josell; A.J. Shapiro ; I. Lev 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 224 KB

Investigation of the mechanism for Ohmic

✍ Luther, B. P.; Mohney, S. E.; Jackson, T. N.; Asif Khan, M.; Chen, Q.; Yang, J. 📂 Article 📅 1997 🏛 American Institute of Physics 🌐 English ⚖ 373 KB

Thermal stability and contact degradatio

✍ Jang, T.; Odekirk, B.; Madsen, L. D.; Porter, L. M. 📂 Article 📅 2001 🏛 American Institute of Physics 🌐 English ⚖ 402 KB