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Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks

✍ Scribed by Jamil Wakil

Book ID: 108210546
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 234 KB
Volume: 46
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2005.01.007

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