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[IEEE Technology (ICAST) - Abuja, Nigeria (2011.11.24-2011.11.26)] 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011) - Investigation of effects of heat sinks on thermal performance of microelectronic package

โœ Scribed by Ekpu, Mathias; Bhatti, Raj; Ekere, Ndy; Mallik, Sabuj; Amalu, Emeka; Otiaba, Kenny


Book ID
127371071
Publisher
IEEE
Year
2011
Weight
329 KB
Category
Article
ISBN
1467307580

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