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The relationship between chemical structure and dielectric properties of plasma-enhanced chemical vapor deposited polymer thin films

✍ Scribed by Hao Jiang; Lianggou Hong; N. Venkatasubramanian; John T. Grant; Kurt Eyink; Kevin Wiacek; Sandra Fries-Carr; Jesse Enlow; Timothy J. Bunning

Book ID
108289511
Publisher
Elsevier Science
Year
2007
Tongue
English
Weight
546 KB
Volume
515
Category
Article
ISSN
0040-6090

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## Abstract Plasma‐enhanced (PE) CVD from α‐methylstyrene is a dry method for synthesizing directly patternable sacrificial materials for generating pores or air dielectric layers. Films deposited at low power excitation (40 W) decompose between 65 °C and 75 °C, leave minimal residue following a 40